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大功率LED封装
摘要：最近一些年来，发光二极管（LED）以其环保、节能、全固态、长寿命等特点受到了广泛的关注，特别是大功率高亮度的LED在固态照明应用领域里的技术突破，使人们对其取代传统光源的希望越来越强。从目前的发展情况来看，大功率LED要真正实现产普及化和业化仍然受到诸多因素的制约，其中，封装过程中的散热效果和可靠性相对传统光源不高是目前大功率LED应用中普遍存在的问题。
本文从理论方面向大家介绍了与LED相关的许多知识：
①介绍了LED的结构和发光原理，并选取了一些与LED紧密相关的特性加以说明。
②介绍了LED芯片的制备工艺、LED芯片的结构以及芯片的封装工艺的流程。
③重点解决大功率LED在封装时遇到的各种问题，并给出对应的解决方法。本文就其中的几个重点加以讲述，包括封装的可靠性问题、取光率问题以及散热问题。
关键词：大功率LED；封装；可靠性；散热性能
High power LED package
Abstract：In recent years, light emitting diode (LED) for its environmental protection, energy saving, all solid, long life and other characteristics has been widespread concern, especially high-power high brightness LED technology breakthroughs in the field of solid-state lighting applications, so as to affirm replace conventional light sources hope getting stronger. From the current development situation, the production of high-power LED to realize universal and industrialization remain constrained by many factors, which encapsulates the process of cooling effect and reliability compared to conventional light sources is not high-power LED applications widespread problem.
From theory to introduce a lot of knowledge and LED-related:
① The structure and light-emitting principle of LED, and select a number of closely related with LED characteristics will be described.
② The preparation process of LED chip architecture and chip packaging process flow LED chips.
③ focused on solving the problems of high-power LED package encountered when, and gives the corresponding solutions. This article describes just a few of them focus on reliability issues, including packaging, light extraction efficiency issues and heat.
Keywords: high power LED, packaging, reliability, heat-release performance
摘要：最近一些年来，发光二极管（LED）以其环保、节能、全固态、长寿命等特点受到了广泛的关注，特别是大功率高亮度的LED在固态照明应用领域里的技术突破，使人们对其取代传统光源的希望越来越强。从目前的发展情况来看，大功率LED要真正实现产普及化和业化仍然受到诸多因素的制约，其中，封装过程中的散热效果和可靠性相对传统光源不高是目前大功率LED应用中普遍存在的问题。
本文从理论方面向大家介绍了与LED相关的许多知识：
①介绍了LED的结构和发光原理，并选取了一些与LED紧密相关的特性加以说明。
②介绍了LED芯片的制备工艺、LED芯片的结构以及芯片的封装工艺的流程。
③重点解决大功率LED在封装时遇到的各种问题，并给出对应的解决方法。本文就其中的几个重点加以讲述，包括封装的可靠性问题、取光率问题以及散热问题。
关键词：大功率LED；封装；可靠性；散热性能
High power LED package
Abstract：In recent years, light emitting diode (LED) for its environmental protection, energy saving, all solid, long life and other characteristics has been widespread concern, especially high-power high brightness LED technology breakthroughs in the field of solid-state lighting applications, so as to affirm replace conventional light sources hope getting stronger. From the current development situation, the production of high-power LED to realize universal and industrialization remain constrained by many factors, which encapsulates the process of cooling effect and reliability compared to conventional light sources is not high-power LED applications widespread problem.
From theory to introduce a lot of knowledge and LED-related:
① The structure and light-emitting principle of LED, and select a number of closely related with LED characteristics will be described.
② The preparation process of LED chip architecture and chip packaging process flow LED chips.
③ focused on solving the problems of high-power LED package encountered when, and gives the corresponding solutions. This article describes just a few of them focus on reliability issues, including packaging, light extraction efficiency issues and heat.
Keywords: high power LED, packaging, reliability, heat-release performance
目录
1 绪论 1
1.1 固态照明 1
1.2 LED发展历程 2
1.3 LED市场现状与发展前景 3
2 LED简介 5
2.1 LED结构及发光原理 5
2.2LED特性 6
2.2.1 电学特性 6
2.2.2 光学特性 8
2.3 白光LED简介 9
2.3.1 白光LED发光原理 9
2.3.2 荧光粉 11
3 LED芯片制备 13
3.1 芯片制备过程 13
3.2 芯片结构 13
4 功率型LED封装 15
4.1 LED封装简介 15
4.2 封装工艺流程 15
5 大功率LED封装的问题 18
5.1 封装可靠性问题 18
5.1.1 影响可靠性的因素 18
5.1.2 提高可靠性的方法 20
5.2 LED取光问题 21
5.2.1影响取光效率的封装要素 21
5.3 LED散热问题 23
5.3.1热量的传递方式 23
5.3.2 LED的热阻 24
5.3.3 低热阻封装工艺 27
5.3.4 LED的结温及结温分析 28
5.3.5 散热器的结构和原理 30
6 总结 35
参考文献 37
参考文献
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